(50 SQUARES) 155368 Tin-Silver-Copper (SAC) Wire: 96.5Sn 3.0Ag 0.5Cu
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Tin-Silver-Copper (SAC) Wire: 96.5Sn 3.0Ag 0.5Cu
Very popular lead-free solder alloy.
Alloy: 96.5Sn 3.0Ag 0.5Cu
Diameter: .030″
Quantity: 3 FT Spool
Liquidus Melting Temperature: 220°C
Solidus Melting Temperature: 217°C
Pb-Free: Yes
These types of preforms are ideal for automated through-hole manufacturing to ensure 100% hole fill, or they can be used for minimizing voiding underneath QFN thermal pads. They usually require a standard lead-free reflow profile with a liquidus melting point between 217°C and 221°C
