(1PC) IS42S32160B-7BLI DRAM Chip SDRAM 512M-Bit 16Mx32 3.3V 90-Pin WBGA
Tax included.
THIS LISTING IS FOR (1PC) OF IS42S32160B-7BLI BY ISSI
SPECIFICATIONS
| Mfr Package Description | 11 X 13 MM, 0.80 MM PITCH, LEAD FREE, WBGA-90 |
| REACH Compliant | Yes |
| EU RoHS Compliant | Yes |
| Status | EOL |
| Sub Category | DRAMs |
| Access Mode | FOUR BANK PAGE BURST |
| Access Time-Max | 5.4 ns |
| Clock Frequency-Max (fCLK) | 142.0 MHz |
| Interleaved Burst Length | 1,2,4,8 |
| I/O Type | COMMON |
| JESD-30 Code | R-PBGA-B90 |
| JESD-609 Code | e1 |
| Memory Density | 5.36870912E8 bit |
| Memory IC Type | SYNCHRONOUS DRAM |
| Memory Width | 32 |
| Moisture Sensitivity Level | 3 |
| Number of Functions | 1 |
| Number of Ports | 1 |
| Number of Terminals | 90 |
| Number of Words | 1.6777216E7 words |
| Number of Words Code | 16M |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Min | -40.0 Cel |
| Operating Temperature-Max | 85.0 Cel |
| Organization | 16MX32 |
| Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | TFBGA |
| Package Equivalence Code | BGA90,9X15,32 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supplies (V) | 3.3 |
| Qualification Status | Not Qualified |
| Refresh Cycles | 8192.0 |
| Seated Height-Max | 1.2 mm |
| Sequential Burst Length | 1,2,4,8,FP |
| Standby Current-Max | 0.004 Amp |
| Supply Current-Max | 0.3 Amp |
| Supply Voltage-Nom (Vsup) | 3.3 V |
| Supply Voltage-Min (Vsup) | 3.0 V |
| Supply Voltage-Max (Vsup) | 3.6 V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.8 mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 10 |
| Length | 13.0 mm |
| Width | 11.0 mm |
| Additional Feature | AUTO/SELF REFRESH |
