(1PC) CS5535-UDC AMD Companion Device 208-Pin BGA
Tax included.
THIS LISTING IS FOR (1PC) OF CS5535-UDC BY AMD
SPECIFICATIONS
| Mfr Package Description | 23 X 23 MM, 2.13 MM HEIGHT, 1.27 MM PITCH, PLASTIC, MO-151BAJ-2, BGA-208 |
| REACH Compliant | Yes |
| Status | Discontinued |
| Microprocessor/Microcontroller/Peripheral IC Type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| Address Bus Width | 32.0 |
| Boundary Scan | YES |
| Bus Compatibility | PCI; CARDBUS; USB; ISA; ATA |
| Clock Frequency-Max | 67.5 MHz |
| Communication Protocol | ASYNC, BIT; SYNC, BYTE |
| Data Encoding/Decoding Method | NRZ |
| Data Transfer Rate-Max | 0.1875 MBps |
| External Data Bus Width | 32.0 |
| JESD-30 Code | S-PBGA-B208 |
| JESD-609 Code | e0 |
| Low Power Mode | YES |
| Moisture Sensitivity Level | 3 |
| Number of Serial I/Os | 2.0 |
| Number of Terminals | 208 |
| Operating Temperature-Min | 0.0 Cel |
| Operating Temperature-Max | 85.0 Cel |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | BGA |
| Package Equivalence Code | BGA208,17X17,50 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Power Supplies | 1.5,3.3 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 2.34 mm |
| Sub Category | Other Microprocessor ICs |
| Supply Voltage-Nom | 1.5 V |
| Supply Voltage-Min | 1.14 V |
| Supply Voltage-Max | 1.58 V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | OTHER |
| Terminal Finish | Tin/Lead (Sn63Pb37) |
| Terminal Form | BALL |
| Terminal Pitch | 1.27 mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Length | 23.0 mm |
| Width | 23.0 mm |