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(1 PC) 70V7339S133BCI IDT Multi-Port SRAM, 512KX18, 15ns, CMOS, PBGA256
(1 PC) 70V7339S133BCI IDT Multi-Port SRAM, 512KX18, 15ns, CMOS, PBGA256
(1 PC) 70V7339S133BCI IDT Multi-Port SRAM, 512KX18, 15ns, CMOS, PBGA256

(1 PC) 70V7339S133BCI IDT Multi-Port SRAM, 512KX18, 15ns, CMOS, PBGA256

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Multi-Port SRAM, 512KX18, 15ns, CMOS, PBGA256

Part #: 70V7339S133BCI
Part Category: Memory ICs
Manufacturer: Integrated Device Technology
Description: Multi-Port SRAM, 512KX18, 15ns, CMOS, PBGA256

Mfr Package Description 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256
Status Transferred
Sub Category SRAMs
Access Time-Max 15.0  ns
Clock Frequency-Max (fCLK) 133.0  MHz
I/O Type COMMON
JESD-30 Code S-PBGA-B256
JESD-609 Code e0
Memory Density 9437184.0  bit
Memory IC Type MULTI-PORT SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Ports 2
Number of Terminals 256
Number of Words 524288.0  words
Number of Words Code 512K
Operating Mode SYNCHRONOUS
Operating Temperature-Min -40.0  Cel
Operating Temperature-Max 85.0  Cel
Organization 512KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Seated Height-Max 1.7  mm
Standby Current-Max 0.04  Amp
Standby Voltage-Min 3.15  V
Supply Current-Max 0.675  Amp
Supply Voltage-Nom (Vsup) 3.3  V
Supply Voltage-Min (Vsup) 3.15  V
Supply Voltage-Max (Vsup) 3.45  V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.0  mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Length 17.0  mm
Width 17.0  mm
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE