(1PC) MT29F1G08ABBHC-ET:B 1GB 8bit FLASH MEMBORY BGA
Tax included.
THIS LISTING IS FOR (1PC) OF MT29F1G08ABBHC-ET:B BY MICRON
SPECIFICATIONS
REACH Compliant | Yes |
EU RoHS Compliant | Yes |
Status | Discontinued |
Type | NAND TYPE |
Sub Category | Flash Memories |
Access Time-Max | 30.0 ns |
Command User Interface | YES |
Data Polling | NO |
JESD-30 Code | R-PBGA-B63 |
JESD-609 Code | e3 |
Memory Density | 1.073741824E9 bit |
Memory IC Type | FLASH |
Memory Width | 8 |
Moisture Sensitivity Level | 1 |
Number of Sectors/Size | 1K |
Number of Terminals | 63 |
Number of Words | 1.34217728E8 words |
Number of Words Code | 128M |
Operating Temperature-Min | -40.0 Cel |
Operating Temperature-Max | 85.0 Cel |
Organization | 128MX8 |
Package Body Material | PLASTIC/EPOXY |
Package Code | FBGA |
Package Equivalence Code | BGA63,10X12,32 |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, FINE PITCH |
Page Size (words) | 2K |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Cel) | 225 |
Power Supplies (V) | 1.8 |
Qualification Status | Not Qualified |
Ready/Busy | YES |
Sector Size (Words) | 128K |
Standby Current-Max | 5.0E-5 Amp |
Supply Current-Max | 0.02 Amp |
Supply Voltage-Nom (Vsup) | 1.8 V |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | INDUSTRIAL |
Terminal Finish | MATTE TIN |
Terminal Form | BALL |
Terminal Pitch | 0.8 mm |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Toggle Bit | NO |