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(1PC) XCV150-4BG352C Xilinx FPGA 164.674K 250MHz 0.22um (CMOS) 2.5V 352-Pin BGA
(1PC) XCV150-4BG352C Xilinx FPGA 164.674K 250MHz 0.22um (CMOS) 2.5V 352-Pin BGA
(1PC) XCV150-4BG352C Xilinx FPGA 164.674K 250MHz 0.22um (CMOS) 2.5V 352-Pin BGA
(1PC) XCV150-4BG352C Xilinx FPGA 164.674K 250MHz 0.22um (CMOS) 2.5V 352-Pin BGA
(1PC) XCV150-4BG352C Xilinx FPGA 164.674K 250MHz 0.22um (CMOS) 2.5V 352-Pin BGA
(1PC) XCV150-4BG352C Xilinx FPGA 164.674K 250MHz 0.22um (CMOS) 2.5V 352-Pin BGA

(1PC) XCV150-4BG352C Xilinx FPGA 164.674K 250MHz 0.22um (CMOS) 2.5V 352-Pin BGA

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This listing is for (1PC) of XCV150-4BG352C by Xilinx

Status Discontinued
Clock Frequency-Max (MHz) 250.00000
Combinatorial Delay of a CLB-Max (ns) 0.8000000000000000
JESD-30 Code S-PBGA-B352
J-STD-609 Code e0
Length (mm) 35.0000
Moisture Sensitivity Level 3
Number of CLBs 864
Number of Equivalent Gates 164674
Number of Inputs 260
Number of Logic Cells 3888
Number of Outputs 260
Number of Terminals 352
Operating Temperature-Max (Cel) 85.0
Operating Temperature-Min (Cel) 0.0
Organization 864 CLBS, 164674 GATES
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA352,26X26,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
DLA Qualification Not Qualified
Seated Height-Max (mm) 1.7000
Supply Voltage-Max (V) 2.62500
Supply Voltage-Min (V) 2.37500
Supply Voltage-Nom (V) 2.5
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch (mm) 1.270
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width (mm) 35.0000